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[Features]
● The mounting density is improved compared to chip resistors.
● Mounting cost reduction by decreasing the number of parts mounting times.
● 2, 4 and 8 elements of SMD resistor arrays.
● Precision type ±1% is available.
● Higher self-alignment effect in reflow-soldering process.
● Image recognition during mounting is easy.
● Suitable for both flow and reflow soldering.
● Compatible with AEC-Q200 (data acquisition). (CN1J4)
● More advancement in the mounting density than individual chip resistors.
● Mounting cost reduction by decreasing the number of parts mounting times.
● 2, 4 and 8 elements of SMD resistor arrays.
● Precision type ±1% is available.
● Higher self-alignment effect in reflow-soldering process.
● Suitable for an image recognition mounter due to square corner design.
● Suitable for both reflow and flow soldering.
● AEC-Q200 Qualified (CN1J4).
Mounting Type | Surface Mount | Circuit type | Insulation Type | Resistance value(Ω) | 1M |
---|---|---|---|---|---|
Rated Power(W) | 0.063 | Allowable error | ±5% | Temperature Coefficient(%) | ±200ppm/K |
Number of Pins | 8.0 | Number of resistors | 4.0 | Operating Temperature Range(℃) | -55 to 125 |
Case Height | 0.45mm | Case Length | 2mm | Case Width | 1mm |
Series | CN-K | Taping Specifications | TD |
Please check the type/dimensions/specifications of the part CN1E4KTTD105J in the CN Chip Networks, CN-K Chip Networks series.
How can we improve?
How can we improve?