DF11 Series 2‑mm Grid Double-Row Connector (UL/CSA Standard Certified Product)

Caution
Product Description
[Features]
· The contact configuration has been condensed into 2 rows with a 2-mm pitch and 5-mm width.
· Allows for twice the number of signals with the same amount of space as a conventional 2‑mm pitch single-row connector.
· Available with either crimped or IDC contacts. Board-to-cable, in-line and board-to-board connector types are also available, enhancing board design flexibility.
· Choose from gold or tin plating to match application. SMT-compatible products are also available.
· Accommodates 22 AWG to 30 AWG wires even with a compact 2‑mm double-row design.
· Reduce man-hours and eliminate manual work processes for easy wiring by using a fully-automatic IDC machine, even for tedious multi-harnessing (branch wire connections).
[Applications]
· For all types of OA equipment, including copy machines and printers.
2‑mm Grid Double-Row Connector (UL/CSA Standard Certified Product)

The DF11 Series is ideal for all types of OA equipment including copiers and printers
Specifications of DF11 Series 2‑mm Pitch Board-to-Cable Connectors (Double-Row Connector Type)
Product Standards
| Rating | Rated current (Note 1) | Crimp | Wire size | AWG 22 to 26: 2 A AWG 28: 1 A AWG 30: 0.5 A | Operating Temperature Range | -30 to 85°C (Note 2) | |
|---|---|---|---|---|---|---|---|
| Operating humidity range | 40 to 80% | ||||||
| Insulation displacement | Wire size | AWG 26: 1 A | Storage temperature range | -10 to 60°C (Note 3) | |||
| Rated voltage | Crimp | 250 V AC | Insulation displacement | 100 V AC | Storage humidity range | 40 to 70% (Note 3) | |
| UL-CSA Safety Standard Certified Standard Values | |||
|---|---|---|---|
| Rating | Rated Current | Wire size | AWG 22: 2 A AWG 24 to 28: 1 A AWG 30: 0.5 A |
| Rated voltage | 30 V AC | ||
UL/CSA safety standard File No.
UL: E52653 / CSA: LR95109
| Item | Standard | Conditions | |||
|---|---|---|---|---|---|
| 1. Insulation resistance | 1,000 MΩ or more | Measure at 500 V DC | |||
| 2. Withstand voltage | There shall be no flashover or dielectric breakdown. | Energize at 650 V AC for 1 min. | |||
| 3. Contact resistance | 30 mΩ or less | Measure at 100 mA | |||
| 4. Single unit insertion/extraction force | Min. 0.3 N (30 gf), Max. 4.4 N (450 gf) | Measure using a steel pin of □0.5 ±0.002 mm | |||
| 5. Vibration resistance | There shall be no discontinuity for 1 μs or greater. | Frequency: 10 to 55 Hz, Single amplitude: 0.75 mm, Three directions, 2 hours | |||
| 6. Humidity resistance | Contact resistance: 30 mΩ or less, Insulation resistance: 500 MΩ or more | Leave at temperature 40°C ±2°C and humidity 90 to 95% for 96 hours | |||
| 7. Temperature cycle | Contact resistance: 30 mΩ or less, Insulation resistance: 1,000 MΩ or more | (-55°C: 30 mins > 5 to 35°C: 10 mins > 85°C: 30 mins > 5 to 35°C: 10 mins) 5 cycles | |||
| 8. Durability (Mating / Un-mating) | Contact resistance: 30 mΩ or less | Tin-plated: 30 times | Gold-plated: 50 times | ||
| 9. Solder heat resistance | No melting of resin parts affecting performance. | DIP type | Flow: 260°C for 10 seconds | Manual solder: Soldering iron temperature of 300°C for 2 seconds | |
| SMT type | Reflow: Using the recommended temperature profile | Manual solder: Soldering iron temperature of 300°C for 3 seconds | |||
(Note 1) The rated current may vary depending on the wire size used. Only the rating of the header is 2 A.
(Note 2) This includes temperature increases caused by the flow of current.
(Note 3) The term "storage" refers to products stored for long periods of time prior to mounting and use. The operating temperature and humidity range are applicable in a non-energized state after board mounting.
(Note 4) Information contained in this catalog represents general requirements for this product series.
Materials
| Product | Part Name | Materials | Finish | UL Standard |
|---|---|---|---|---|
| Crimp socket | Insulator | Polyamide resin | Black | UL94V-0 |
| Crimp contacts for sockets | Contacts | Phosphor bronze | Tin plating or gold plating | - |
| ID socket | Insulator | Polyamide resin | Black | UL94V-0 |
| Contacts | Phosphor bronze | Tin plating | - | |
| Receptacle | Insulator | Polyamide resin | Black | UL94V-0 |
| Contacts | Phosphor bronze | Tin plating or gold plating | - | |
| Pin header | Insulator | Polyamide resin | Black | UL94V-0 |
| Contacts | Brass | Tin plating or gold plating | - | |
| SMT pin header | Insulator | Polyamide resin | Beige | UL94V-0 |
| Contacts | Brass | Tin plating or gold plating | - | |
| Bracket | Brass | Tin plating | - | |
| In-line plug | Insulator | Polyamide resin | Black | UL94V-0 |
| In-line plug contact | Contacts | Phosphor bronze | Tin plating or gold plating | - |
| In-line adapter | Insulator | Polyamide resin | Black | UL94V-0 |
| Contacts | Brass | Tin plating | - |
Product Features

List of Product Features
This product is a 4-wall box type equipped with a mis-insertion prevention rib, simple lock, and a rib for preventing erroneous insertion and erroneous insertion between dissimilar contacts.

Features of DF11 Insulation Displacement Machine (Single Core Punching Full Automatic ID Machine AM700/DF11)
Five main features of AM700/DF11 insulation displacement machine
- 1. Multi-harnessing (branch wire connections) can be performed.
- 2. Significantly reduced setup time. (10 mins. or less)
- 3. Space-saving design. (Approximately half the size of previous machines)
- 4. Low cost, meaning low initial risk when introducing.
- 5. Harness data can be saved to floppy disk, meaning changes can be made easily.
Summary
Since DF11 insulation displacement allows for double row insulation displacement with a single part, harnessing work is performed to complete with machine-based termination only. Furthermore, because there is only one part, inventory control is easy.
Product Usage Precautions
1. Recommended temperature profile (SMT)

(Note 1) The same conditions can be applied twice. However, the temperature between the 1st and 2nd cycles should be returned to room temperature.
(Note 2) The temperature profile indicates the board surface temperature at the point of contact with the connector lead part.
(Note 3) These conditions shall be applied to embossed packaged items (moisture-proof packaging.) (Within 168 hours of unsealing)

(Note 4) These conditions are applied to embossed packaged items without moisture-proof packaging and embossed packaged items that have been removed from moisture-proof packaging for 168 hours or more.
2. Recommended manual soldering conditions (SMT)
- Soldering iron temperature: 290°C ±10°C
- Soldering time: 2 seconds or less
3. Recommended screen thickness (SMT)
0.15 to 0.2 mm
4. Board warpage (SMT)
Max 0.03 mm in the connector center area, based on both connector edges
5. Recommended soldering conditions (DIP)
- Flow conditions for automatic soldering devices
Solder temperature: 250°C ±5°C, Soldering time: within 10 seconds - Manual soldering conditions
Soldering iron temperature: 290°C ±10°C, Soldering time: within 2 seconds