1 mm Pitch, Circuit Board-to-Cable / FPC / Micro Coaxial Connector, DF19 Series
Caution
Product Description
[Features]
· Has received high praise from the market as a high-performance connector supporting LVDS high-speed differential signals, and has secured the position as the de facto standard for LCD panels.
· A thin design that accepts micro-coaxial type cables with a thickness of 1.5 mm (1.6 mm max) and FPC type with a maximum thickness of 1.7 mm.
· The connectors feature a single type of header and 3 types of interchangeable sockets (cable type, FPC type, micro-coaxial type), offering more options for wire connections.
· The external dimensions of the 3 socket types have been made uniform, allowing use in a wide variety of designs.
· Headers include on-board type, offset type, reverse offset type, and vertical connection type, each of which can support a wide variety of designs.
· Ground line connection is possible through the metal shell.
· Glow wire compatible (conforming to IEC60695-2-11).
[Applications]
· Mobile phones, LCD-related devices, DVCs, DSCs, PDAs, camera modules, and other small devices.
1 mm Pitch Thin-Type Connector for Board-to-Cable Connections, Board-to-FPC Connections, Board-to-Micro Coaxial Connections
DF19 Series list
Product Specifications
Product Standards
| Rating | Rated Current | AWG#28: 1 A AWG#30: 0.9 A AWG#32: 0.8 A AWG#36: 0.5 A FPC: 0.5 A Micro Coaxial Cable AWG#40: 0.3 A | Operating Temperature Range | -35 to 85°C (Note 1) | Storage temperature range | -10 to 60°C (Note 2) |
|---|---|---|---|---|---|---|
| Rated voltage | 100 V AC | Operating humidity range | 40 to 80% | Storage humidity range | 40 to 70% (Note 2) |
| Item | Standard | Conditions |
|---|---|---|
| 1. Insulation resistance | 500 M or more | Measure at 100 V DC. |
| 2. Withstand voltage | There shall be no flashover or dielectric breakdown | Energize at 300 V AC for 1 min. |
| 3. Contact resistance | 30 mΩ or less (FPC is 50 mΩ or less) | Measure at 100 mA |
| 4. Single unit insertion/extraction force | Min: 0.2 N (20 gf), Max: 3 N (300 gf) | Measure using a steel pin with a thickness of 0.2 ±0.005 |
| 5. Vibration resistance | There shall be no discontinuity for 1 μs or greater | Frequency: 10 to 55 Hz, Single amplitude: 0.75 mm, Three directions, 2 hours |
| 6. Humidity resistance | Contact resistance: standard value or less, Insulation resistance: 500 MΩ or more | Leave at temperature 40 ±2°C and humidity 90 to 95% for 96 hours |
| 7. Temperature cycle | Contact resistance: standard value or less, Insulation resistance: 500 MΩ or more | (-55°C: 30 mins > 5 to 35°C: 10 mins > 85°C: 30 mins > 5 to 35°C: 10 mins) 5 cycles |
| 8. Durability (Mating / Un-mating) | Contact resistance: standard value or less | 30 mating / un-mating cycles |
| 9. Solder heat resistance | No melting of resin parts affecting performance | Reflow: At the recommended temperature profile, Manual soldering - Soldering iron temperature: 300°C for 3 seconds |
(Note 1) This includes temperature increases caused by the flow of current.
(Note 2) The term "storage" refers to products stored for long periods of time prior to mounting and use.
The operating temperature range and humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation.
Materials/Processing
| Product | Part Name | Materials | Color/Finish | UL Standard |
|---|---|---|---|---|
| Pin header | Insulator | Polyamide resin | Black or beige | UL94V-0 |
| Contacts | Phosphor bronze | Selective gold plating | - | |
| Outer shell | Phosphor bronze | Partial tin plating or tin-copper plating | - | |
| Crimp case | Insulator | Polyamide resin | Beige | UL94V-0 |
| Outer shell | Stainless steel | Tin-copper plating | - | |
| Crimp contacts for sockets | Contacts | Phosphor bronze | Gold plating | - |
| FPC socket | Insulator | Polyamide resin | Beige | UL94V-0 |
| Contacts | Phosphor bronze | Selective gold plating | - | |
| Grounding board for FPC | Outer shell | Stainless steel | Tin-copper plating | - |
| Micro coaxial socket | Insulator | LCP resin | Beige | UL94V-0 |
| Contacts | Phosphor bronze | Selective gold plating | - | |
| Outer shell | Phosphor bronze | Tin plating | - | |
| Grounding plate for micro coaxial cable | Outer shell | Phosphor bronze | Tin plating | - |
Features of DF19 Series 1‑mm Pitch Connector for Board to Cable / FPC / Micro Coaxial Cable Connections
Multiple variations
Available with top-board type, offset type, reverse offset type, and vertical mounting type headers, allowing use in a wide variety of setups.
Top-board type
Offset type
Reverse offset type
Vertical mounting type
Each header includes 3 compatible types of socket (cable type, FPC type, micro coaxial type), providing more options for wire connections.
For FPC connections
For cable connections
For micro coaxial cable connections
Thin-Type Design
Cable, micro coaxial cable type: 1.5‑mm thickness (max. 1.6 mm) FPC type: Thin type design with a maximum thickness of just 1.7 mm.
Cable connections
FPC connections
Uniform External Dimensions
The outer dimensions of all sockets (cable type, FPC type, micro coaxial cable type) are the same
The outer dimensions of the 3 socket types have been made uniform, allowing use in a wide variety of setups.
Example of Product Usage
Can be used for cell phones, LCD equipment, DVC, DSC, PDA, camera modules and other small devices.
Product Usage Precautions
1. Recommended temperature profile
- The same conditions can be applied twice. However, the temperature between the 1st and 2nd cycles should be returned to room temperature
- The temperature profile indicates the board surface temperature at the point of contact with the connector lead part
- Although the grounding plate may become discolored, this will have no effect on product performance
Recommended temperature profile
2. Recommended manual solder conditions
Soldering iron temperature: 290°C ±10°C, Soldering time: within 3 seconds
3. Recommended screen thickness
0.15 mm
4. Board warpage
Max 0.03 mm in the connector center area, based on both connector edges
5. Cleaning conditions
Refer to "Wire-to-Board Connector Use Handbook"
6. Termination conditions
Refer to "Wire-to-Board Connector Use Handbook."
Because the crimped contacts are extremely small, crimping should be performed carefully while referring to the "Crimping Condition Sheet" and "Crimping Quality Standards"
7. Precautions
Be aware that twisting excessively during mating / un-mating may result in breakage
8. Handling
Refer to "Wire-to-Board Connector Use Handbook"