1.25‑mm Pitch Low-Profile Type Crimp Connector, DF14 Series

Caution
Product Description
[Features]
· Right angle dedicated connector pursuing low profile on the circuit board.
· Signals can be fetched even from locations where there is no board-to-board space.
· The offset type has a low profile with a circuit-board mounting height of just 1.6 mm, which is shorter.
· The header has a suction surface capable of vacuum suction, and automatic mounting by embossed packing is possible.
· In addition, magazine packaging can be selected for the on-board type.
· The header has a box structure to prevent twisting, and measures against misinsertion are thorough. In addition, there is a wall on the circuit board side, so there is no harm caused by rubbing the board with a socket.
· Reinforced metal fittings are added to prevent solder peeling.
[Applications]
· Various consumer products including LCD (liquid crystal)s, notebook computers, mobile devices, small OA equipment and other audio and visual equipment.
Low-Profile Type 1.25‑mm Pitch Rectangular Board-to-Cable Connectors With Reduced Board Mounting Height

The DF14 series can be used for various consumer products including LCDs, laptop computers, mobile devices, small OA equipment and other audio and visual equipment

Circuit board mounting diagram
DF14(A) type

Circuit board mounting diagram
DF14H type
Main Features of DF14 Series Low Profile 1.25‑mm Pitch Board-to-Cable Connectors
Product Standards
| Rating | Rated Current | 1 A | Operating Temperature Range | -35 to 85°C (Note 1) | Storage temperature range | -10 to 60°C (Note 2) |
|---|---|---|---|---|---|---|
| Rated voltage | 150 V AC | Operating humidity range | 40 to 80% | Storage humidity range | 40 to 70% (Note 2) |
| Item | Standard | Conditions | ||
|---|---|---|---|---|
| 1. Insulation resistance | 500 MΩ or more | Measure at 100 V DC | ||
| 2. Withstand voltage | There shall be no flashover or dielectric breakdown. | Energize at 500 V AC for 1 min. | ||
| 3. Contact resistance | 30 mΩ or less | Measure at 100 mA | ||
| 4. Single unit insertion/extraction force | Min 0.15 N (15 gf), Max. 3 N (300 gf) | Measure using a steel pin of □0.3 ±0.002 mm | ||
| 5. Vibration resistance | There shall be no discontinuity for 1 μs or greater. | Frequency: 10 to 55 Hz, Single amplitude: 0.75 mm, Three directions, 2 hours | ||
| 6. Humidity resistance | Contact resistance: 30 mΩ or less, Insulation resistance: 500 MΩ or more | Leave at temperature 40°C ±2°C and humidity 90 to 95% for 96 hours | ||
| 7. Temperature cycle | Contact resistance: 30 mΩ or less, Insulation resistance: 500 MΩ or more | (-55°C: 30 mins > 5 to 35°C: 10 mins > 85°C: 30 mins > 5 to 35°C: 10 mins) 5 cycles | ||
| 8. Durability (Mating / Un-mating) | Contact resistance: 30 mΩ or less | Tin-plated: 30 mating / un-mating cycles, Gold-plated: 50 mating / un-mating cycles | ||
| 9. Solder heat resistance | No melting of resin parts affecting performance. | SMT type | Reflow: Using the recommended temperature profile | Manual solder: Soldering iron temperature of 300°C for 3 seconds |
(Note 1) This includes temperature increases caused by the flow of current.
(Note 2) The term "storage" refers to products stored for long periods of time prior to mounting and use. The operating temperature and humidity range are applicable in a non-energized state after board mounting.
(Note 3) Information contained in this catalog represents general requirements for this product series.
Materials
| Product | Part Name | Materials | Finish | UL Standard |
|---|---|---|---|---|
| Crimp socket | Insulator | Polyamide resin | Beige | UL94V-0 |
| Crimp contacts for sockets | Contacts | Phosphor bronze | Tin plating or gold plating | - |
| Pin header | Insulator | Polyamide resin | Beige | UL94V-0 |
| Contacts | Brass | Tin-copper plating or gold plating | - | |
| Bracket | Phosphor bronze | Tin-copper plating | - |