1.25-mm Pitch Miniature Crimp Connector (UL Standard Certified Product), DF13 Series
Caution
Product Description
[Features]
· Low-profile design to materialize 5.8 mm of mounted height. (SMT mount straight type).
(DIP types are 5.3 mm on the straight and 3.6 mm at the right-angle.)
· 2-column type features a multi-pin of up to 40 pins to make higher density of mount area than 1-column type by 30%.
· Header grades are available that feature adsorption type surfaces for use in vacuum suction type mounting. Also supports automatic mounting using embossed packaging.
· Header features a box structure that prevents prying to have a perfect preventive measure for erroneous insertion.
· Surface mount (SMT) header includes a reinforced metal fitting to prevent solder peeling.
· UL Standard compliant.
· Supports use with glow wires (compliant with IEC 60695-2-11).
[Applications]
· Various consumer equipment including laptop computers, mobile information terminals, small office appliances and audio and visual equipment.
Main Features of DF13 Series 1.25‑mm Pitch Board-to-Cable Connectors
Supports automatic mounting: Features an adsorption type surface for use with automatic mounting equipment
| Type | Mounting Method | Mounting Height (h) | |
|---|---|---|---|
| Straight type | DIP |  | 5.3 mm |
| SMT |  | 5.8 mm | |
| Right angle type | DIP |  | 3.6 mm |
| SMT |  | ||
Low-profile mounting height
Miniature size
Low-profile mounting height of 5.8 mm. (SMT mounting straight type) (DIP types are 5.3 mm on the straight and 3.6 mm at the right-angle.)
Multi-contact
The double-row type features up to 40 contacts and a mounting surface with a 30% higher density than single-row types.
Supports automatic mounting
Header grades are available that feature adsorption type surfaces for use in vacuum suction type mounting. Also supports automatic mounting using embossed packaging.
Compact, yet full of functions
The header features a box structure that prevents twisting and erroneous insertion. The surface mounted (SMT) header also includes a reinforced fitting to prevent solder peeling.
Compliant with UL standards
Supports use with glow wires (compliant with IEC 60695-2-11)
Product Standards
| Rating | Rated Current | Standard | 1 A | Operating Temperature Range | -35 to 85°C (Note 1) | Storage temperature range | -10 to 60°C (Note 2) |
|---|---|---|---|---|---|---|---|
| UL | |||||||
| Rated voltage | Standard | 150 V AC | Operating humidity range | 20 to 80% (Note 3) | Storage humidity range | 40 to 70% (Note 2) | |
| UL | 29.9 V DC/V AC |
| Item | Standard | Conditions | |||||
|---|---|---|---|---|---|---|---|
| 1. Insulation resistance | 500 MΩ or more | Measure at 100 V DC. | |||||
| 2. Withstand voltage | There shall be no flashover or dielectric breakdown. | Energize at 500 V AC for 1 min. | |||||
| 3. Contact resistance | 30 mΩ or less | Measure at 100 mA | |||||
| 4. Single unit insertion/extraction force | Min: 0.3 N (30 gf), Max: 3 N (300 gf) | Measure using a steel pin of □0.35 ±0.002 mm | |||||
| 5. Vibration resistance | There shall be no discontinuity for 1 μs or greater. | Frequency: 10 to 55 Hz, Single amplitude: 0.75 mm, Three directions, 2 hours | |||||
| 6. Humidity resistance | Contact resistance: 30 mΩ or less, Insulation resistance: 500 MΩ or more | Leave at temperature 40°C ±2°C and humidity 90 to 95% for 96 hours | |||||
| 7. Temperature cycle | Contact resistance: 30 mΩ or less, Insulation resistance: 500 MΩ or more | (-55°C: 30 mins > 5 to 35°C: 10 mins > 85°C: 30 mins > 5 to 35°C: 10 mins) 5 cycles | |||||
| 8. Durability (Mating / Un-mating) | Contact resistance: 30 mΩ or less | Tin-plated: 30 times | Gold-plated: 50 times | ||||
| 9. Solder heat resistance | No melting of resin parts affecting performance. | DIP type | Flow: 250°C for 10 seconds | Manual solder: Soldering iron temperature of 300°C for 3 seconds | |||
| SMT type | Reflow: Using the recommended temperature profile | Manual solder: Soldering iron temperature of 300°C for 3 seconds | |||||
(Note 1) This includes temperature increases caused by the flow of current.
(Note 2) The term "storage" refers to products stored for long periods of time prior to mounting and use. The operating temperature and humidity range are applicable in a non-energized state after board mounting.
(Note 3) Avoid condensation when using.
Product Materials/Processing
| Product | Part Name | Materials | Finish | UL Standard |
|---|---|---|---|---|
| Crimp socket | Insulator | Polyamide resin | Beige | UL94V-0 |
| Crimp contacts for sockets | Contacts | Phosphor bronze | Tin plating or gold plating | - |
| Pin header (DIP) | Insulator | Polyamide resin | Beige | UL94V-0 |
| Contacts | Brass | Tin plating | - | |
| Pin header (SMT single-row) | Insulator | Polyamide resin | Beige | UL94V-0 |
| Contacts | Brass | Tin plating or gold plating | - | |
| Bracket | Phosphor bronze | Tin plating | - | |
| Pin header (SMT double-row) | Insulator | Polyamide resin | Beige | UL94V-0 |
| Contacts | Brass | Tin-copper plating or gold plating | - | |
| Bracket | Phosphor bronze | Tin plating | - |
Product Specifications
| Connector Type | Contact, socket, header, other |
|---|---|
| Harness | No, yes |
| Compliance Standards | JIS, IEC |
| Safety Standards | UL |
| Number of Contacts | 2, 10, 11, 12, 13, 14, 15, 20, 30, 3, 40, 4, 5, 6, 7, 8, 9 |
| No. of Rows (Mating Part) | 1, 2 |
| Mounting Pitch | 1.25 mm |
| Opening Pitch | 1.25 mm |
| Rated Current | 1 A |
| Rated Voltage (AC) | 150 V AC |
| Number of Matings and Un-Matings | 30, 50 |
| Board Mounting Method | SMT, through-hole DIP |
| Opening Direction | Straight, right-angle |
| Board Mounting Style | Standard on-board |
| Contact Plating | Gold, tin, tin-copper |
| Wiring Method | Crimp |
| Compatible Wire Type | Discrete wire |
| Compatible Wire Size (AWG) Min. | AWG 32, 30 |
| Compatible Wire Size (AWG) Max. | AWG 26, 30 |
| Operating Temperature Range (Max.) | 85°C |
| Operating Temperature Range (Min.) | -35°C |
| Glow Wire Compatible | Yes |
Product Usage Precautions
Recommended temperature profile (SMT)
[Applicable conditions]
- 1. Peak temperature: Max. 250°C
- 2. Heating area: 230°C or more for less than 60 seconds
- 3. Preheating area: 170 to 190°C for 60 to 120 seconds
- 4. Cycles: 2 or less
*Measurement conducted at contact lead part.
The temperature profile may vary due to external conditions such as the type of cream solder, manufacturer, and board size. Be sure to check all potential factors before use.
(Note 1) This temperature profile is a recommended value.
(Note 2) The same conditions can be applied twice. However, the temperature between the 1st and 2nd cycles should be returned to room temperature.
(Note 3) The temperature profile indicates the board surface temperature at the point of contact with the connector lead part.
(Note 4) Slight variations in color of the insulating case after reflow do not affect the form, fit or function of the connector.
Soldering iron temperature: 290 ±10°C, Soldering time: 2 seconds or less
3. Recommended screen thickness (SMT)0.15 to 0.2 mm
4. Board warpage (SMT)Max 0.03 mm in the connector center area, based on both connector edges
5. Recommended soldering conditions (DIP)■ Flow conditions for automatic soldering equipment - Soldering temperature: 250°C ±5°C, Soldering time: 3 seconds or less
■ Manual soldering conditions: Soldering iron temperature: 290°C ±10°C, Soldering time: 2 seconds or less
Supports IPA cleaning. (Cleaning is not recommended because cleaning may change the insertion/extraction feeling etc. Please inquire regarding the use of other cleaners.)
7. Wiring conditions■ Because the crimped contacts are extremely small, crimping should be performed carefully while referring to the "Crimping Condition Sheet" and "Crimping Quality Standards".
8. Precautions■ Be aware that twisting excessively during insertion and extraction may result in breakage.
Product Handling
![Precautions for insertion (How to hold) Lightly grip the base of the cable and press the connector with your finger to insert. (Insertion angle) [Caution] Do not insert at an angle of 30° or more. Doing so may cause contact deformation or case breakage. (How to insert) Insert the connector horizontally.](http://th.misumi-ec.com/en/linked/vitem/el/HRS1/222000425771/img/222000425771_jh_w03.jpg)
Precautions for insertion
(How to hold)
Lightly grip the base of the cable and press the connector with your finger to insert.
(Insertion angle)
[Caution] Do not insert at an angle of 30° or more. Doing so may cause contact deformation or case breakage.
(How to insert) Insert the connector horizontally.
![Precautions for removal (How to hold) Remove by holding the cable so that the entire cable is pulled out evenly. (Removal angle) [Caution] Do not remove at an angle of 30° or more. Doing so may cause contact deformation or case breakage. (How to remove) Remove the connector horizontally.](http://th.misumi-ec.com/en/linked/vitem/el/HRS1/222000425771/img/222000425771_jh_w04.jpg)
Precautions for removal
(How to hold)
Remove by holding the cable so that the entire cable is pulled out evenly.
(Removal angle)
[Caution] Do not remove at an angle of 30° or more. Doing so may cause contact deformation or case breakage.
(How to remove) Remove the connector horizontally.