MELSEC-F Series Analog Input/Output
Brand :
MITSUBISHI
Caution
- This product belongs in RoHS Directive under Category 9 "Monitoring and control equipment" with exclusion from the usage restriction of phthalate esters until 21 July 2021.
Product Description
12‑bit binary resolution analog input/output adapter.
[Features]
· Mixed input/output type with 2 analog input channels and 1 analog output channel.
· A 2‑channel voltage input (0 V to 10 V DC), or a current input (4 to 20 mA DC) can be used.
· A 1-channel voltage output (0 V to 10 V DC), or a current output (4 to 20 mA DC) can be used.
· Input voltage or input current can be specified for each channel.
[Applications]
· Convenient for conversion of analog input signal to digital values, and for conversion of digital values to analog output signal.
Analog Input/Output Adapter FX3U-3A-ADP
Drawing (unit: mm)
Compatible Standards
| Compatible Standards | CE(EMC) UL/cUL KC |
|---|
Performance Specifications
| Analog Input | Analog Input Range | Voltage Input | 0 to 10 V DC (input resistance 198.7 kΩ) |
|---|---|---|---|
| Current Input | 4 to 20 mA DC (input resistance 250Ω) | ||
| Number of Input Channels | 2 channels | ||
| Absolute Maximum Input | Voltage Input | -0.5 V, +15 V | |
| Current Input | -2 mA, +30 mA | ||
| Input Characteristics | Input mode (voltage/current input) is configurable for each channel. | ||
| Digital Output | 12-bit binary | ||
| Resolution | Voltage Input | 2.5 mV (10 V×1/4,000) | |
| Current Input | 5μA (16 mA×1/3,200) | ||
| Overall Accuracy | Voltage Input | Ambient Temperature 25°C±5°C: For Full-scale 10 V±0.5% (±50 mV) Ambient Temperature 0°C to 55°C: For Full-scale 10 V±1.0% (±100 mV) | |
| Current Input | Ambient Temperature 25°C±5°C: For Full-scale 16 mA±0.5% (±80μA) Ambient Temperature 0°C to 55°C: For Full-scale 16 mA±1.0% (±160μA) | ||
| A/D Conversion Time | When Connected to FX3U/FX3UC Sequencer | 80μs× Number of input channels used + 40μs× Number of output channels used (Data is updated every operating period.) | |
| When Connected to FX3S/FX3G/FX3GC Sequencer | 90μs× Number of input channels used + 50μs× Number of output channels used (Data is updated every operating period.) | ||
| Insulation Method | · Insulation between the analog input/output part and the sequencer: by opto-isolator · Insulation between the drive power supply and the analog input/output part: by DC/DC converter · Non-insulated between channels | ||
| Analog Output | Analog Output Range | Voltage Output | 0 to 10 V DC (external load resistance 5 k to 1 MΩ) |
| Current Output | 4 to 20 mA DC (external load resistance 500Ωor less) | ||
| Number of Output Channels | 1 channel | ||
| Output Characteristics | Output mode (voltage/current output) is configurable. | ||
| Digital Input | 12-bit binary | ||
| Resolution | Voltage Output | 2.5 mV (10 V×1/4,000) | |
| Current Output | 4μA (16 mA×1/4,000) | ||
| Overall Accuracy | Voltage Output | Ambient temperature 25°C±5°C: for full-scale 10 V±0.5% (±50 mV) Ambient temperature 0°C to 55°C: for full-scale 10 V±1.0% (±100 mV) If the external load resistance (Rs) is smaller than 5 kΩ, the value will be increased by those calculated below. (100 mV increase for every 1%.) 47×100/(Rs+47)-0.9(%) | |
| Current Output | Ambient Temperature 25°C±5°C: For Full-scale 16 mA±0.5% (±80μA) Ambient Temperature 0°C to 55°C: For Full-scale 16 mA±1.0% (±160μA) | ||
| D/A Conversion Time | When Connected to FX3U/FX3UC Sequencer | 80μs × Number of input channels used + 40μs × Number of output channels used (Data is updated every operating period.) | |
| When Connected to FX3S/FX3G/FX3GC Sequencer | 90μs× Number of input channels used + 50μs× Number of output channels used (Data is updated every operating period.) | ||
| Insulation Method | · Insulation between the analog input/output part and the sequencer: by opto-isolator · Insulation between the drive power supply and the analog input/output part: by DC/DC converter · Non-insulated between channels | ||
| Number of Occupied Inputs/Outputs | 0 (regardless of the maximum number of input/output points of the sequencer) | ||
| Applicable Sequencer | FX3S, FX3G (Ver. 1.20 or later), FX3U (Ver. 2.61 or later), FX3GC, FX3UC (Ver. 2.61 or later) Connection to FX3S requires FX3S-CNV-ADP. Connection to FX3G requires FX3G-CNV-ADP. Connection to FX3U and to FX3UC-32MT-LT (-2) requires a function expansion board. | ||
| Weight | Approx. 0.1 kg | ||
Power Supply Specification
| Power Supply | Conversion Circuit Drive Power Supply | 24 V DC +20%, -15%, 90 mA Power shall be supplied by connecting a 24 V DC power supply to the terminal block. |
|---|---|---|
| Interface Drive Power Supply | 5 V DC, 20 mA Power is supplied internally from the 5 V DC power supply of the base unit. |
General Specifications
| Ambient Temperature | 0 to 55°C: While in operation, -25 to 75°C: While in storage | ||
|---|---|---|---|
| Relative Humidity | 5 to 95% RH (no condensation): While in operation | ||
| Vibration Resistance | When Mounted to DIN Rail | Frequency: 10 to 57 Hz | Single amplitude: 0.035 mm, 10 times in each direction of X, Y and Z (total of 80 minutes each) |
| Frequency: 57 to 150 Hz | Acceleration: 4.9 m/s2 10 times in each direction of X, Y and Z (total of 80 minutes each) | ||
| When Mounted Directly | Frequency: 10 to 57 Hz | Single Amplitude: 0.075 mm, 10 times in each direction of X, Y and Z (total of 80 minutes each) | |
| Frequency: 57 to 150 Hz | Acceleration: 9.8 m/s2 10 times in each direction of X, Y and Z (total of 80 minutes each) | ||
| Impact Resistant | 147 m/s2, for an activation period of 11 ms, 3 times in each direction of X, Y and Z with a half-sine pulse | ||
| Noise Resistance | Noise voltage 1,000 Vp-p, noise width 1μs, rise time 1 ns, according to a noise simulator with frequency 30 to 100 Hz | ||
| Voltage-resistance | Between all terminals as a whole and the earth terminal: 500 V AC for 1 minute | ||
| Insulation Resistance | Between all terminals as a whole and the earth terminal: 5 MΩ or more on an 500 V DC ohmmeter | ||
| Grounding | Class D grounding (ground resistance: 100Ωor less) "Shared grounding with a high-power system is not allowed" Use dedicated or shared ground. | ||
| Operating Atmosphere | There shall be no corrosion gas or flammable gas and not much conductive dust | ||
| Altitude of Use | 2,000 m or lower Cannot be used in environments pressurized above atmospheric pressure. Doing so may cause failure. | ||