PLC MELSEC iQ-F FX5UC Series Sequencer CPU

Brand :
MITSUBISHI

Caution

    Product Description

    - PLC MELSEC iQ-F FX5UC series by Mitsubishi electric.
    - Save space by eliminating the need for a terminal block.
    - Device information can be shared with simple parameter settings, so the programming man-hours can be reduced.
    - View the system status even from a remote location.
    - Prevents data theft, tampering, misoperation, illegal execution, etc. caused by unauthorized access from a third party with the security functions.
    - Information can be saved to the SD memory card periodically from the computer and network equipment.

    MELSEC iQ-F FX5UC Series Sequencer CPU Specifications

    FX5UC-32MT/D

    FX5UC-32MT/D image

    FX5UC-32MT/D image

    • CPU performance

    The sequence execution engine, which is the heart of the MELSEC iQ-F, is a newly developed execution engine supporting structured programs, execution of multiple programs, ST language, FB, etc.

    • Control scale: up to 512 points

    When remote I/Os (CC-Link, AnyWireASLINK or Bitty Series) are used, up to 512 points can be controlled.

    • Built-in positioning (200 kHz, built-in 4 axes)

    A positioning function based on pulse outputs from the 4 axes, is provided.
    You can also set the table method and use applied commands corresponding to the interruption, variable speed operation and simple interpolation functions.

    • Simple motion unit can be connected.

    By connecting the simple motion unit, SSCNET III/H-compatible positioning becomes possible.
    You can create table-method programs combining linear interpolation, 2‑axis arc interpolation and continuous path control to draw smooth paths with ease.

    • Built-in Ethernet port

    The Ethernet communication port supports communication up to 8 connections on the network, permitting connection with many personal computers and equipment. It also supports remote maintenance and seamless SLMP communication with host equipment, etc.

    • Built-in RS-485 port (with MODBUS function)

    The built-in RS-485 communication port enables communication with up to 16 Mitsubishi general-purpose inverters over a distance of up to 50 m. (The inverters can be controlled using 6 applied commands.)
    The port also supports the MODBUS function, permitting connection with up to 32 peripherals (including the master) such as sequencers, sensors and temperature control units.

    • Built-in SD card slot

    The built-in SD card slot is useful when updating programs or in mass production of equipment.
    You will be able to save data logs in an SD card (future function) for use in the analysis of equipment status, production condition, etc.

    • High-speed system bus communication

    The MELSEC iQ-F, together with a high-speed CPU, achieves high-speed system bus communication of 1.5k word/ms (approx. 150 times faster than the level achievable with the FX3U), to demonstrate its full capability even when intelligent function units generating a lot of data traffic are used.

    • RUN/STOP/RESET switches

    The RUN/STOP switch now has a RESET function.
    This increases the debugging efficiency because the system can be restarted without turning off the main power.

    • Security

    The MELSEC iQ-F provides security functions (file password, remote password, security key) that are designed to prevent data theft, unauthorized operation, etc., by third parties making illegal access.

    • No battery, maintenance-free

    You can save programs without using a battery. Clock data is saved for 10 days using a large-capacity capacitor (the specific period varies depending on the use condition).

    • * You can use an optional battery unit to save (latch) the clock data and device memory in the event of power failure.

    FX5UC-32MT/D Performance Specifications

    Control MethodStored Program Repeating Operation
    Input/Output Control MethodRefresh Method
    (Direct access input/output is possible by specifying the direct access input/output (DX, DY).)
    Programming SpecificationProgramming LanguageLadder Diagram (LD), Structured Text (ST), Function Block Diagram / Ladder Language (FBD/LD)
    Programming Expansion FunctionFunction Block (FB), Structured Ladder, Label Programming (Local/Global)
    Constant Scan0.2 to 2,000 ms (can be set in 0.1 ms intervals)
    Periodic Interrupt1 to 60,000 ms (can be set in 1 ms intervals)
    Timer Performance Specification100 ms, 10 ms, 1 ms
    Program Execution Capacity32 pcs
    FB File Capacity16 files (including up to 15 user files)
    Operation SpecificationExecution TypeStandby type, initial execution type, scan execution type, periodic execution type, event execution type
    Interrupt TypeInternal timer interrupt, input interrupt, high-speed comparison & match interrupt, interrupt from unit
    Command Processing TimeLD X034 ns
    MOV D0 D134 ns
    Memory CapacityProgram Capacity64k steps
    (128 KB, flash memory)
    SD Memory CardMemory Card Capacity (SD/SDHC memory card: up to 16 GB)
    Device / Label Memory120 KB
    Data Memory / Standard ROM5 MB
    Number Of Writes To Flash Memory (Flash ROM)Maximum 20,000 writes
    Maximum File Storage CapacityDevice / Label Memory1
    Data MemoryP: Program File Capacity32 pcs
    FB: FB File Capacity16 pcs
    SD Memory Card2 GB511
    Storage capacity in the root folder.
    4 GB, 8 GB, 16 GB65,534
    Storage capacity in the root folder.
    Clock FunctionDisplayed InformationYear, month, day, hour, minutes, seconds, day of the week (Leap years are automatically detected.)
    AccuracyMonthly difference ±45 sec / 25°C (TYP)
    Number Of Inputs/Outputs(1) Number Of Inputs/Outputs256 points or less
    (2) Number Of Remote I/Os384 points or less
    Total Points Of (1) And (2)512 points or less
    Retention Upon Power Failure (Clock Data)Retention MethodLarge capacitor
    Clock data is retained using the power stored in the large capacitor built in the sequencer. Clock data is not retained correctly if the voltage of the large capacitor drops. In a fully-charged state (power has been supplied to the sequencer for at least 30 minutes), the data can be stored for 10 days using the capacitor (ambient temperature: 25°C). The storage period using the capacitor varies depending on the ambient operating temperature. The higher the ambient operating temperature, the shorter the retention period.
    Retention Period10 days (Ambient temperature: 25°C)
    Retention Upon Power Failure (Device)Retention Capacity Upon Power FailureUp to 12k words
    All devices in the device (high speed) area can be retained upon power failure. If a battery unit is used, the devices in the device (standard) area can also be retained.
    Number Of Devices
    Number Of User DevicesInput Relay (X)Octal1,024 points
    The total number of X and Y points assigned to inputs and outputs, is no more than 256.
    Output Relay (Y)Octal1,024 points
    The total number of X and Y points assigned to inputs and outputs, is no more than 256.
    Internal Relay (M)Decimal32,768 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Latch Relay (L)Decimal32,768 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Link Relay (B)Hexadecimal32,768 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Annunciator (F)Decimal32,768 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Link Special Relay (SB)Hexadecimal32,768 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Step Relay (S)Decimal4,096 points (fixed)
    Timer (Timer (T))Decimal1,024 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Integration Timer (Integration Timer (ST))Decimal1,024 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Counter (Counter (C))Decimal1,024 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Counter (Counter (LC))Decimal1,024 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Data Register (D)Decimal8,000 points (can be changed with a parameter)
    The value can be changed with a parameter within the range permitted by the capacity of the built-in CPU memory.
    Link Register (W)Hexadecimal32,768 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Link Special Register (SW)Hexadecimal32,768 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Number Of System DevicesSpecial Relay (SM)Decimal10,000 points (fixed)
    Special Register (SD)Decimal12,000 points (fixed)
    Unit Access DeviceIntelligent Function Unit DeviceDecimal65,536 points (specified by U□¥G□)
    Number Of Index RegistersIndex Register (Z)Decimal24 points
    Index registers (Z) and long index registers (LZ) can be set for a total of 24 words or less.
    Long Index Register (LZ)Decimal12 points
    Index registers (Z) and long index registers (LZ) can be set for a total of 24 words or less.
    Number Of File RegistersFile Register (R)Decimal32,768 points (can be changed using parameters)
    Can be changed using parameters within the CPU built-in memory capacity range.
    Number Of NestingsNesting (N)Decimal15 points (fixed)
    Number Of PointersPointer (P)Decimal4,096 points
    Interrupt Pointer (I)Decimal178 points (fixed)
    OtherDecimal Constant (K)Signed16 bits: -32,768 to +32767
    32 bits: -2,147,483,648 to +2,147,483,647
    Unsigned16 bits: 0 to 65,535
    32 bits: 0 to 4,294,967,295
    Hexadecimal Constant (H)16 bits: 0 to FFFF
    32 bits: 0 to FFFFFFFF
    Real Constant (E)Single PrecisionE-3.40,282,347+38 to E-1.17,549,435-38, 0, E1.17,549,435-38 to E3.40,282,347+38
    Character StringShift JIS code, up to 255 single-byte characters (256 characters including NULL)
    Power Supply Specification
    Power Supply Voltage24 V DC
    Voltage Fluctuation Range+20%, -15%
    Allowable Momentary Power Outage DurationOperation will continue following a momentary power outage of 5 ms or less.
    Power Supply Fuse125 V 3.15 A Time Lag Fuse
    Inrush CurrentMax. 35 A for 0.5 ms or less / 24 V DC
    Power Consumption5 W / 24 V DC [30 W / 24 V DC + 20%, -15%]
    The value assumes that the CPU unit is used alone.
    The value in [ ] assumes a configuration based on the maximum allowable connections to the CPU unit.
    (Any external 24‑V DC power supply for expanded equipment is not included.)
    5 V DC Power Supply Capacity720 mA
    24‑V DC Power Capacity500 mA
    Input Specification
    Number Of Input Points16 points
    Input Connection FormatConnector
    Input FormatSink
    Input Signal Voltage24 V DC +20%, -15%
    Input Signal CurrentX000 to X0175.3 mA / 24 V DC
    Input ImpedanceX000 to X0174.3 kΩ
    Input ON Sensing CurrentX000 to X0173.5 mA or more
    Input OFF Sensing Current1.5 mA or less
    Input Response FrequencyX000 to X005200 kHz
    Refer to the MELSEC iQ-F FX5UC User’s Manual (Hardware) for details on importing pulses of response frequencies between 50 kHz and 200 kHz.
    X006 to X01710 kHz
    Input Response Time (H/W Filter Delay)X000 to X005ON: 2.5 μs or less
    OFF: 2.5 μs or less
    X006 to X017ON: 30 μs or less
    OFF: 50 μs or less
    Input Response Time (Digital Filter Setting Value)None, 10 μs, 50 μs, 0.1 ms, 0.2 ms, 0.4 ms, 0.6 ms, 1 ms, 5 ms, 10 ms (default), 20 ms, 70 ms
    If the use environment is subject to a lot of noise, set a digital filter.
    Input Signal FormatNon-voltage Contact Input
    NPN Open Collector Transistor
    Input Circuit InsulationPhotocoupler Insulation
    Input Operation IndicatorThe LED is lit when the input is ON. (DISP switch IN side)
    Output Specification
    Number Of Outputs16 points
    Output Connection FormatConnector
    Output Type / FormatTransistor / Sink Output
    External Power Supply5 to 30 V DC
    Maximum LoadY000 to Y0030.3 A/point
    See below for the total load current per common.
    output 8 point/common: 0.8 A or less
    (1.6 A or less if two common terminals are connected externally)
    Y004 Or Later0.1 A/point
    See below for the total load current per common.
    output 8 point/common: 0.8 A or less
    (1.6 A or less if two common terminals are connected externally)
    Leakage Current When Open0.1 mA or less / 30 V DC
    Voltage Drop In ON StateY000 to Y0031.0 V or less
    Y004 or later1.5 V or less
    Response TimeY000 to Y0032.5 μs or less / 10 mA or more (5 to 24 V DC)
    Y004 or later0.2 ms or less / 100 mA (24 V DC)
    Output Circuit InsulationPhotocoupler Insulation
    Output Operation IndicatorThe LED is lit when the output is ON. (DISP switch OUT side)

    FX5UC-32MT/D Function Specifications

    Scan Monitor Function (Watchdog Timer Setting)The scan time is monitored to detect CPU unit hardware and program errors.
    Clock FunctionThis function can be used for time management relating to date-stamping of error history and other system functions.
    Runtime WriteRuntime Circuit Block ChangePortions edited on the ladder editing screen of the engineering tool are written to the CPU unit for each circuit. Edited items that apply to multiple locations can be written to the CPU unit all at once.
    Interrupt FunctionMultiple Interrupt FunctionAssume that, when an interrupt program is running, an interrupt due to a different reason occurs. In this case, the program of the lower priority is interrupted, and the program of the higher priority, whose running conditions are satisfied, is run.
    PID Control FunctionPID control is performed using PID control commands.
    Constant ScanA program is run repeatedly while maintaining a constant scan time.
    Remote OperationRemote RUN/STOPWhile keeping the RUN/STOP/RESET switch on the CPU unit at the RUN position, the CPU unit is changed to the RUN/STOP/PAUSE state externally.
    Remote PAUSEWhile keeping the RUN/STOP/RESET switch on the CPU unit at the RUN position, the CPU unit is changed to the RUN/STOP/PAUSE state externally.
    Remote RESETWhen the CPU unit is in the STOP state, an external operation is performed to reset the CPU unit.
    Device / Label Memory Area SettingThe capacity of each device / label memory area is set.
    Default Device SettingsThe devices used by a program is set without using program.
    Latch FunctionThe CPU unit settings for devices/labels are retained after a power outage, or even when the power is turned off and then turned back on.
    Memory Card FunctionSD Memory Card AbortEven when a function that uses an SD memory card is running, use of the SD memory card can be stopped without turning off the power.
    Boot OperationThe files stored in the SD memory card are transferred to the transfer destination memory automatically determined by the CPU unit, when the CPU unit power is turned off and then turned back on or the CPU unit is reset.
    Device / Label Access Service Processing SettingThe number of times the device / label access service processing is implemented as part of the end processing, is set by a parameter.
    RAS FunctionSelf-Diagnostic FunctionThe CPU unit diagnoses itself for error.
    Error ResetAll present errors are reset at once.
    Security FunctionThe customer’s assets saved to the personal computer or FX5 system unit is protected against theft, falsification, mis-operation, unauthorized execution, etc., by third parties making illegal access.
    Built-In I/O FunctionsHigh-Speed Counter FunctionInputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
    Pulse Width Measurement FunctionInputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
    Input Interrupt FunctionInputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
    Timer Interrupt FunctionInputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
    High-Speed Counter Interrupt FunctionInputs to the CPU unit can be used to perform high-speed counter operation, pulse width measurement, input interrupt, timer interrupt, high-speed counter interrupt, etc.
    Built-In Positioning FunctionTransistor outputs from the CPU unit can be used to perform positioning operations for up to 4 axes.
    PWM Output FunctionTransistor outputs from the CPU unit can be used to generate PWM outputs.
    Built-In Ethernet FunctionEthernet-related functions such as connecting the MELSOFT product and GOT, and socket communication.
    Serial Communication FunctionSerial communication-related functions such as simple links between personal computers, MC protocol, inverter communication function and non-procedural communication.
    MODBUS RTU Communication FunctionMODBUS RTU-compatible products can be connected. Master/slave function can be used.

    FX5UC-32MT/D General Specifications

    Ambient Operating Temperature-20 to 55°C, assuming no icing
    Subject to input/output derating. For details, refer to the MELSEC iQ-F FX5UC User’s Manual (Hardware).
    0 to 55°C for products manufactured before June 2016. For an intelligent function unit, refer to the manual for each product.
    The following equipment cannot be used at an ambient temperature below 0°C:
    FX5-40SSC-S, FX5-CNV-BUS, FX5-CNV-BUSC, Battery (FX3U-32BL), SD memory card (NZ1MEM-2GBSD, NZ1MEM-4GBSD, NZ1MEM-8GBSD, NZ1MEM-16GBSD, L1MEM-2GBSD, L1MEM-4GBSD), FX3 Extension Unit, Terminal Unit, I/O Cable (FX-16E-500CAB-S, FX-16E-□CAB, FX-16E-□CAB-R) The specifications vary if used in an environment below 0°C. For details, refer to the MELSEC iQ-F FX5UC User’s Manual (Hardware).
    Ambient Storage Temperature-25 to 75°C, assuming no icing
    Ambient Operating Humidity5 to 95% RH, assuming no condensation
    If the product is used in a low-temperature environment, make sure sudden temperature shift does not occur. If sudden temperature shift occurs due to opening/closing of the control panel, etc., condensation may occur and cause fire, failure or malfunction. Also, provide air-conditioning to dehumidify the air to prevent condensation.
    Ambient Storage Humidity5 to 95% RH, assuming no condensation
    Vibration ResistanceWhen Mounting To DIN RailFrequency: 5 To 8.4 HzSingle amplitude: 1.75 mm 10 times in each direction of X, Y and Z (total 80 minutes each)
    Judgment criteria are based on IEC61131-2.
    Frequency: 8.4 To 150 HzAcceleration: 4.9 m/s2 10 times in each direction of X, Y and Z (total 80 minutes each)
    Judgment criteria are based on IEC61131-2.
    Impact Resistance147 m/s2, for a duration of 11 ms, three times in each two-way direction of X, Y and Z with a half-sine pulse
    The judgment criteria shall conform to IEC61131-2.
    Noise ResistanceAchieved through a noise simulator with a noise voltage of 1,000 Vp-p, noise width of 1 μs and frequency of 30 to 100 Hz
    Withstand VoltageBetween Power Supply Terminal (24 V DC) And Earth Terminal500 V AC for 1 min
    Between Input Terminal (24 V DC) And Earth Terminal500 V AC for 1 min
    Between Output Terminal (Transistor) And Earth Terminal500 V AC for 1 min
    Insulation ResistanceBetween Power Supply Terminal (24 V DC) And Earth Terminal10 MΩ or more at 500 V DC on an insulation resistance meter
    Between Input Terminal (24 V DC) And Earth Terminal10 MΩ or more at 500 V DC on an insulation resistance meter
    Between Output Terminal (Transistor) And Earth Terminal10 MΩ or more at 500 V DC on an insulation resistance meter
    EarthingClass D earthing (earthing resistance: 100 Ω or less) <No common earthing with a strong magnetic system>
    <Precaution>
    · Provide dedicated earthing whenever possible. If dedicated earthing cannot be provided, use common earthing. (Refer to the manual for details.)
    · Provide an earthing point as close as possible to the sequencer to shorten the length of the earthing wire.
    Operating AtmosphereThere shall be no corrosion gas or flammable gas and not much conductive dust.
    Operating Altitude0 to 2,000 m
    Cannot be used in a pressurized environment of atmospheric pressure or higher.
    Failures may occur.
    Installation LocationInside the control panel
    Overvoltage CategoryII or lower
    Indicates the assumed power distribution point to which the applicable equipment is connected between the public power distribution network and the mechanical system in plant. Category II applies to the equipment to which power is supplied from a fixed facility. The surge resistance voltage of equipment of up to 300 V in rating is 2,500 V.
    Pollution Degree2 or lower
    Index to indicate the degree of conductive material generation in the environment in which the applicable equipment is used. Pollution degree 2 indicates that only non-conductive contaminants will generate. In this environment, however, temporary conduction may occur due to accidental condensation.
    Equipment ClassClass 2
    • * See the catalog for model numbers other than those detailed above.
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