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Solder winding

Days to Ship
  • ALL
  • 2 Day(s) or Less
  • 4 Day(s) or Less
  • 5 Day(s) or Less
  • Soldering Tools, Lead-free Solder (Round, Stick)

    Soldering Tools, Lead-free Solder (Round, Stick)

    MISUMI

    Highly reliable lead-free solder as good as Sn-Pb-based solder

    Days to Ship
    4 Day(s)
  • Tin-lead Solder Sn60% / Pb40%

    Tin-lead Solder Sn60% / Pb40%

    HOZAN

    Composition: Sn60%/Pb40% [Features] - Non-cleaning type for micro soldering to meet minimization of poles of fine pitch parts and non-use of CFC. - It employs a bobibin for electrostatic discharge countermeasures.

    Days to Ship
    2 Day(s)
  • Lead-free Solder Sn96.5% / Ag3% / Cu0.5%

    Lead-free Solder Sn96.5% / Ag3% / Cu0.5%

    HOZAN

    Uses lead-free solder JEITA recommended alloy [Features] - Employes low-scattering flux. - It is a JEITA recommended alloy and the solder is led-free with high performance and reliability.

    Days to Ship
    2 Day(s) or more
  • Soldering Tools, Lead-free Solder (with Resin)

    Soldering Tools, Lead-free Solder (with Resin)

    MISUMI

    Easy to carry with included case

    Days to Ship
    4 Day(s)
  • Soldering Tools, Solder Reel Mount

    Soldering Tools, Solder Reel Mount

    MISUMI

    Wire solders can be taken out smoothly

    Days to Ship
    2 Day(s)
  • Stainless Steel Soldering (H-710)

    Stainless Steel Soldering (H-710)

    HOZAN

    apart from aluminum and titanium, nearly all metals have wire diameter: 1.6 mm ø length: 2.5m Sn 40%, Pb 60% [Features] - Can be used with nearly all metals apart from aluminum and titatium: stainless steel, nichrome, copper, brass, nickel plate, galvanized, bimetal, tin plate, steel etc. - Uses soluble flux that can easily be washed away with water.

    Days to Ship
    2 Day(s)
  • Lead-free Solder Sn99% / Ag0.3% / Cu0.7%

    Lead-free Solder Sn99% / Ag0.3% / Cu0.7%

    HOZAN

    Low cost lead free solder. - Composition: Sn 99%/Ag 0.3%/Cu 0.7% [Features] - Low cost lead free solder. - Using a flux with good wetting, reduction in workability is kept to a minimum. - When changing from Sn-3Ag-0.5Cu solder there is no need to introduce new equipment or change method greatly. - The tin (SN) lead (Pb) type solder that has been used traditionally has excellent wetting, melting point, mechanical strength and copper erosion properties but since lead's effect on the environment became a problem, many lead free solder alloys have been developed. - However, lead free solders have a high melting point.

    Days to Ship
    2 Day(s) or more
  • Tin-lead Solder Sn50% / Pb50%

    Tin-lead Solder Sn50% / Pb50%

    HOZAN

    Flux characteristics: RA composition: Sn50%/Pb50% [Features] - Can be used with nearly all metals apart from aluminum and titatium: stainless steel, nichrome, copper, brass, nickel plate, galvanized, bimetal, tin plate, steel etc. - Uses soluble flux that can easily be washed away with water.

    Days to Ship
    2 Day(s)
  • Lead-free Solder Sn99.3% / Cu + Ni0.7%

    Lead-free Solder Sn99.3% / Cu + Ni0.7%

    HOZAN

    Lead-free solder/flux characteristics: RMA component: Sn 99.3%/Cu + Ni 0.7% [Features] - Lead-free solder that has a gloss finish close to that of tin-lead solder. - It is a solder with less copper erosion and relatively little damage of the soldering tip.

    Days to Ship
    2 Day(s)

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